Western Digital (WD) presents the next generation of 3D NAND flash-- BiCS3, featuring 64 layers of vertical storage capability on a single 3-bits-per-cell chip, making it the smallest from the company.
Co-developed with Toshiba, BiCS3 will initially be deployed in 256 gigabit capacity before availability in a range of capacities reaching up to half a terabit on a single chip. It will run alongside the current range of BiCS2 3D NAND products.
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