Corsair announces a DDR4-5000 addition to the Vengeance LPX DDR4 memory range, with speeds reaching the 5000MHz barrier (a first, the company says) available in a 16GB(2x 8GB DIMMS) kit.

According to Corsair, such speeds are capable using "select" MSI X570 motherboards running 3rd gen AMD Ryzen desktop processors. Specifically, it says testing took place using  MSI MEG X570 GODLIKE, MSI MEG X570 ACE, MSI MEG X570 UNIFY and PRESTIGE X570 CREATION motherboards, all using included automated overclocking utilities.

G.Skill adds high-capacity, high-performance specifications based on 32GB modules to a number of memory series, available in dual- and quad-channel kits offering data transfer rates from 2666MT/s to 4000MT/s.

Memory series getting the 32GB modules include the Trident Z Royal DDR4-3200 CL16 256GB (32GBx8), Trident Z Royal DDR4-4000 CL18 128GB (32GBx4), Trident Z Neo DDR4-3600 CL18 128GB (32GBx4), and Trident Z Neo DDR4-3800 C18 64GB (32GBx2). Based on pre-binned 16Gb chips and proprietary PCBs, the lower-end modules are available as single pieces while the higher-end options are available as dual- and quad-channel kits for high-end desktops and workstations.

The UDIMMs feature an XMP 2.0 SDP for setting speeds beyond JEDEC. The highest-performing kits for AMD Ryzen 3000-based PCs are the 64GB DDR4-3800 CL18 and the 128GB DDR4-3600 CL18. Intel users get the 128GB DDR4-4000 CL18 and the 256GB DDR4-3200 CL16. Currently AMD validation involves the MSI MEG X570 Godlike motherboard, whereas Intel validation is on the ASUS ROG Rampage VI Extreme Encore motherboard.

Corsair announces the Vengeance LPX DDR4 Memory-- a 16GB (x2 8GB) kit the company claims sets a "new record" with clock speeds reaching up to 4866MHz, at least when paired with 3rd gen AMD Ryzen processors and X570 motherboards.

While compatible with most modern platforms, the modules are designed and tested to achieve 4866MHz on the Ryzen 3000 platform using Asus ROG Crosshair VIII Formula, MSI MEG X570 Godlike and MSI Prestige X570 Creation motherboards using the included automated overclocking utilities. An included optional Vengeance Airflow Fan directly cools the memory modules, and comes in silver, blue or red to match the style of the system in question.

Taiwanese PC component maker G.Skill adds high-frequency, high-capacity kits to the glittery Trident Z Royal series, with DDRDDR4-4300MHz CL19-19-19-39 and DDR4-4000MHz CL16-18-18-38 options at 64GB (8x8GB) and 32GB (4x8GB) capacities.

Built using high performance Samsung B-die components, the kits are aimed at professional users and enthusiasts wanting "both high-capacity and extreme speed memory." The company backs such claims by testing the Trident Z Royal Series DDR4-4300MHz CL19-19-19-39 64GB (8x8GB) memory kit on the AsusROG Rampage VI Extreme Encore motherboard (Intel X299 platform) fitted with an  Intel Core i9-9820X (10C/20T) processor.

Micron claims it is the first company to start mass production of 16Gb DDR4 and LPDDR4X memory products using 3rd Generation 10 nm-class fabrication technology, also known as 1z nanometer.

“Development and mass production of the industry’s smallest feature size DRAM node are a testament to Micron’s world-class engineering and manufacturing capabilities, especially at a time when DRAM scaling is becoming extremely complex,” the company says. “Being first to market strongly positions us to continue offering high-value solutions across a wide portfolio of end customer applications.”

SK Hynix announces a High Bandwidth Memory (HBM) update-- HBM2E DRAM promising "the industry's highest bandwidth" in the shape of a 50% bandwidth increase and 100% additional capacity over the previous HBM2.

According to the company, HBM2E supports bandwidth reaching over 460GB per second, based on 3.6Gbps performance per pin with 1024 data I/Os. TSV (Through Silicon Via) technology allows the vertical stacking of a maximum of eight 16Gb chips, creating a single, dense package with 16GB data capacity.

Taiwanese memory maker G.Skill announces the "extremely low latency" Trident Z Neo series DDR4-3800MHz CL14 RGB memory kits, available in 16GB (8GBx2) and 32GB (8GBx4) capacities for the AMD Ryzen 3000 series CPU and X570 platform.

Built using select Samsung B-die memory chips and a custom PCB, the memory kits run at 3800MHz with up to 58GB/s bandwidth, allowing customers to "push the limits" on the AMD Ryzen 3000 platform. The unbuffered DIMMs come with aluminium heat spreaders and, as typical of hardware aimed at the gamer market, RGB LEDs.

Performance PC memory maker G.Skill announces a DDR4 memory series for use with the AMD Ryzen 3000 series CPUs on the X570 platform-- the Trident Z Neo, with optimised specifications within a sleek dual-tone heatspreader design.

The Ryzen 3000 series platform handles memory speeds of up to DDR4-5774MHz, the fastest achieved on an AMD platform (if under extreme liquid nitrogen cooling). G.Skill claims the Trident Z Neo is engineered to "achieve optimal performance" on the platform, with frequency speeds reaching DDR4-3600 at CL14-15-15-35 timings at 1.4V during tests using an X570-based motherboard with a 6-core Ryzen 5 3600 processor.