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The Fastest G.Skill DDR4 SO-DIMM

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The Fastest G.Skill DDR4 SO-DIMM

Taiwanese memory maker G.Skill announces what it claims is the fastest DDR4 SODIMM yet-- the Ripjaw memory kit running at DDR4-4000MHz CL18-18-18-38 32GB (4x8GB) at 1.35V.

The kit narrowly beats last week's Corsair Vengeance DDR4 SODIMM offering, which achieved "super-tight CL19-23-23-45 timings at 1.35V." Built out of "rigorously hand-binned Samsung B-die DDR4 IC components," the G.Skill memory kit should be ideal for high performance systems by reducing data transfer latency.

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Corsair Claims Memory Record

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Corsair Claims Memory Record

The Vengeance SODIMM DDR4 4000 32GB (4x8GB) is a record breaker, Corsair says-- aimed at high-performance gaming machines and boasting "super-tight CL19-23-23-45 timings at 1.35V."

The memory kits require DDR4 SODIMMs, and are designed for use on the high-end desktop Intel X299 motherboard platform in SFF and mini-ITX form factor. The 32GB kit comes in four 8GB modules built on eight-layer PCB, and Corsair says it is made using hand-sorted and extensively binned Samsung B-die ICs memory chips.

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G.Skill Presents DDR4-4266 CL17 Memory Kits

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G.Skill Presents DDR4-4266 CL17 Memory Kits

G.Skill announces a series of 16 and 32GB DDR4 memory kits for Intel Coffee Lake processors-- the CL17 Trident Z RGB DDR4-4266MHz, the first kits from the company offering speeds over DDR4-4000MHz with CL17 timings.

The kits are made using "rigorously hand-binned" Samsung B-die DDR4 IC components, and are rated for DDR4-4000 CL17 17-17-37 at 1.35V, DDR4-4133 CL17 17-17-37 at 1.4V and DDR4-4266 CL17 18-18-38 at 1.45V. The consist of 8GB modules, and come with XMP2.0 SPD profiles to simplify installation on supporting platforms, namely Intel Z370-based motherboards.

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G.Skill DDR4 SO-DIMM Kits for Mini-ITX Boards

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G.Skill DDR4 SO-DIMM Kits for Mini-ITX Boards

G.Skill announces the Ripjaws family of DDR4 SO-DIMM memory kits designed specifically for small-form factor (SFF) platforms, including the fastest SO-DIMM memory kit from the company yet.

The memory kits ,alomg the range come in 4 specifications-- DDR4-3800MHz CL18-18-18-38 32GB (4x8GB), DDR4-3600MHz CL16-16-16-36 32GB (4x8GB), DDR4-3200MHz CL16-16-16-36 32GB (4x8GB), and DDR4-3200MHz CL16-16-16-36 64GB (4x16GB). All are based on the Samsung B-die DDR4 ICs, feature XMP 2.0 profiles and require 1.35V.

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Rambus Claims Fully-Functional DDR5 DIMM

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Rambus Claims Fully-Functional DDR5 DIMM

Memory maker Rambus announces what it says is an industry first-- a fully-functional DDR5 DIMM prototype, one capable of "the speeds required for the upcoming DDR5 standard."

"We are proud to provide an early path to adoption with the first working buffer chip prototype running at the anticipated performance of next-generation DDR5," the company says. "This demonstrates our continued dedication to be first to market and remaining on the leading edge of industry standards."

Standards association JEDEC still has to publish the standard for DDR5, but the memory technology should offer double the bandwidth and the density of DDR4, with improved channel efficiency and greater power efficiency. As such, DDR5 should reach data rates of up to 6.4Gbit/s and deliver a maximum of 51.2GBytes/s, up from the 3.2Gbit/s and 25.6GBytes/s of DDR4.

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G.Skill Intros "Extreme Performance" DDR4 RAM

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G.Skill Intros

G.SKill announces the DDR4-4600MHz CL19-- a DDR4 memory kit promising "extreme performance" built using hand-selected Samsung B-die IC components and aluminium heatspreaders in either black or white.

Designed for dual-channel operation on the Intel X299 HEDT platform, the kit offers total capacity of 16GB (8GB X2), and promises the kind of speed that "was only achievable under extreme overclocking with liquid nitrogen cooling."

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Geil Intros EVO Spear DDR4 Memory Kits

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Geil Intros EVO Spear DDR4 Memory Kits

Geil announces the EVO Spear memory series-- with kits aimed at Intel and AMD Ryzen machines, all designed for gamers and enthusiasts wanting a cost-effective upgrades.

The company says EVO Spear series RAM is optimised for Intel Core X, i7 and i5 processors, including the Z200 and X299 series chipsets. On the other hand the AMD Edition sticks are compatible with Ryzen 7 and 5 processors, and AM4 motherboards. The AMD Edition memory kits have an AMD Ryzen logo on the packaging and modules, while the Intel sticks are nondescript.

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Micron Incident Disrupts DRAM Supply

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Micron Incident Disrupts DRAM Supply

According to TrendForce, Micron suspended the operations of its Inotera Fab-2 fabrication plant in Taiwan following a malfunction of a nitrogen gas dispensing system, leading a disruption in DRAM production.

The Fab-2 site accounts 5.5% of global DRAM production, with an output of 60000 wafer starts per month. This means the disruption will lead to a spike in memory prices, at least according to DRAMeXchange, the TrendForce memory price tracking service. Fab-2 produces DRAM used in PCs, servers and mobile devices, and supply chain news site Evertiq claims it is even makes memory for the iPhone.

"Inotera is also mainly responsible for manufacturing Micron’s LPDDR4 products that go into Apple’s supply chain for iPhone," Evertiq says. "The temporary shutdown of Fab-2 could have an impact on shipments of the upcoming new iPhone devices as well."

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Micron Updates on GDDR5X, GDDR6 Development

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Micron Updates on GDDR5X, GDDR6 Development

Micron releases an update on the development and production of GDDR5X and GDDR6 memory products-- the company plans to introduce improved GDDR5X chips soon, while GDDR6 is to hit mass production on early 2018.

The company first launched "G5X" memory chips at 10Gbps speeds, but now it supplies them in 10, 11 and 12Gdbps, with production focusing on increasing data rates and yields. Currently, the Nvidia Titan Xp GPU uses "Micron's next-gen G5X at 11.4Gbps, which is now in mass production."

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