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Camera Maker RED Claims "Holographic" Phone

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The company known as RED might be famous for high-end digital cinema cameras, but it is now also taking on smartphones with the announcement of the Hydrogen One, the "first holographic media machine."

Hydrogen OneDetails on the Hydrogen One are scant. A bombastic press release claims the device features a 5.7-inch screen able to display regular 2D media, stereo 3D media and "4-view content," something RED fails to actually define. The phone should also be able to handle augmented, virtual and mixed reality, all without need for glasses.

Otherwise, the only details officially known about the smartphone are its featuring a USB-C port, microSD card slot and headphone jack. However, the curious can glean more information from the RED patent for “Modular Digital Camera and Cellular Phone,” which describes a strange device featuring rectangular modules (such as a spare battery, speaker, projector and cameras) users can slot on the back or front.

The Camera-Equipped Smart Wallet

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The Volterman adds a high-tech security twist to the regular wallet-- the "smart" wallet features GPS and 3G connectivity, as well as a RFID protection and a camera allowing it snap pictures of would-be thieves.

VoltermanThe wallet essentially packs the internals of a somewhat dated smartphone, only without the screen. Users can pair it with their phones via Bluetooth 5.0, providing an alarm in case the wallet is lost. The GPS helps in the finding of said wallet, while 3G connectivity turns it into a wifi hotspot.

The aforementioned camera is an optional extra. It switches on when the camera is in lost mode, and snaps and sends photos of anyone who opens the wallet. Powering it are 512MB of RAM and a battery one can also use to charge other mobile devices.

Gartner: 2017 Device Shipments Essentially Flat

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Gartner forecasts global shipments of PCs, tablets and smartphones to reach 2.3 billion in 2017-- a -0.3% decline from 2016, with the market expected to return to slight growth in 2018 with a 1.6% shipment increase.

"Overall, the shipment growth of the device market is steady for the first time in many years," the analyst says. "PC shipments are slightly lower while phone shipments are slightly higher-- leading to a slight downward revision in shipments from the previous forecast."

Gartner market

As one might expect, PC shipments remain on the decline, with 2017 dropping by -3%. However such decline is slower than in recent years, thanks to Windows 10 replacement purchasing. The prices of components such as DRAM and SSDs continue to increase, creating headwinds for the global PC market and (to a lesser extent) the smartphone market. Manufacturers are absorbing at least some of the impact of PC component prices, due to fears that a PC price increase will reduce their share of a competitive market.

TP-Link Routers Get HomeCare Security

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TP-Link presents HomeCare-- a networking security solution featuring built-in Trend Micro antivirus control, dynamic security features and customisable parental controls.

TP-Link routerAvailable as a firmware update for select TP-Link products (namely the recently announced Deco M5 Whole-Home Wifi System and Archer C5400, C3150 and C2300 routers), HomeCare promises an all-in-one solution combining speed with comprehensive security features. An intrusion prevention system protects against malware and hackers, while malicious site blocking prevents access to dodgy websits from within the network.

An additional security layer quarantines previously infested devices joining the network, and provides instant warnings for users to take necessary steps to fix infected devices. Trend Micro should also keep the system up to date with regular updates, ensuring the network remains protected against new threats.

Toshiba Claims QLC BiCS Flash 3D Memory

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Toshiba announces the development of next generation 4-bit-per-cell quadruple-level cell (QLC) 3D flash memory-- allowing it to produce "the world's largest die capacity" at 768Gb (96GB).

Toshiba QLC FlashIn comparison, 3-bit triple-level cell (TLC) 3D flash maxes out at 512Gb.

The technology involves a 64-layer stacked cell structure, and allows the creation of a 1.5TB device with a 16-die stacked architecture in a single package, making another capacity record. This represents a 50% increase in capacity per package, at least when compared to an earlier Toshiba device with 1TB capacity via 16-die stacked architecture in a single package.

Creating such a device poses a number of challenges, since increasing the number of bits-per-cell by one within the same electron count requires twice the accuracy of TLC technology.

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